公开(公告)号：US20210003631A1

公开(公告)日：2021-01-07

申请号：US16915179

申请日：2020-06-29

Applicant: SEMES CO., LTD.

Inventor： Eung Su KIM ,  Chang Taek LEE

IPC: G01R31/28

Abstract: A semiconductor package test apparatus is disclosed. The semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.