公开(公告)号：US20230350304A1

公开(公告)日：2023-11-02

申请号：US17732565

申请日：2022-04-29

Applicant: SEMES CO, LTD.

Inventor： Hae Won CHOI ,  Joon Ho WON ,  Koriakin ANTON ,  Ki Hoon CHOI ,  Eung Su KIM ,  Pil Kyun HEO ,  Min Woo KIM ,  Jin Yeong SUNG ,  Hyo Soo KIM

IPC: G03F7/30 ,  G03F7/32

CPC classification number: G03F7/3021 ,  G03F7/327

Abstract: There are provided an apparatus and a method for providing a substrate, which can suppress any additional reaction between a developing solution and a photoresist (PR) film and prevent any PR remnants from being generated from such additional reaction. The method includes: supplying an organic developing solution onto a substrate while rotating the substrate at a first revolutions per minute (rpm); substituting the organic developing solution with a nonpolar rinse solution by supplying the nonpolar rinse solution onto the substrate while rotating the substrate at a second rpm, which is lower than the first rpm; continuing to supply the nonpolar rinse solution while rotating the substrate at a third rpm, which is higher than the second rpm; and continuing to supply the nonpolar rinse solution while rotating the substrate at a fourth rpm, which is between the second rpm and the third rpm.

公开(公告)号：US20220290921A1

公开(公告)日：2022-09-15

申请号：US17692395

申请日：2022-03-11

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Anton KORIAKIN ,  Joon Ho WON ,  Min Woo KIM ,  Ki Hoon CHOI ,  Eung Su KIM ,  Tae Hee KIM ,  Pil Kyun HEO ,  Jang Jin LEE ,  Jin Yeong SUNG

IPC: F26B5/00

Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.

公开(公告)号：US20230113184A1

公开(公告)日：2023-04-13

申请号：US17865386

申请日：2022-07-15

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN ,  Jae Seong LEE ,  Hae Won CHOI ,  Joon Ho WON ,  Koriakin ANTON ,  Min Woo KIM ,  Hyung Seok KANG ,  Eung Su KIM ,  Pil Kyun HEO ,  Jin Yeong SUNG

IPC: H01L21/67

Abstract: The present disclosure relates to a flow resistance generating unit that generates a flow resistance in a pipe to solve a flow imbalance problem due to a bent pipe and stabilizes an internal airflow, and a substrate treating apparatus including the same. The substrate treating apparatus comprises a fluid supply unit for supplying fluid for treating a substrate and including an upper fluid supply module for supplying the fluid to an upper portion of the substrate, a lower fluid supply module for supplying the fluid to a lower portion of the substrate, and a supply pipe connected to at least one of the upper fluid supply module and the lower fluid supply module, and a flow resistance generating unit installed in the supply pipe and for generating a flow resistance with respect to the fluid passing through the supply pipe.

公开(公告)号：US20210003631A1

公开(公告)日：2021-01-07

申请号：US16915179

申请日：2020-06-29

Applicant: SEMES CO., LTD.

Inventor： Eung Su KIM ,  Chang Taek LEE

IPC: G01R31/28

Abstract: A semiconductor package test apparatus is disclosed. The semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.