公开(公告)号：US20230207336A1

公开(公告)日：2023-06-29

申请号：US18145917

申请日：2022-12-23

Applicant: SEMES CO., LTD.

Inventor： Chulnam KIM ,  Sunghun EOM ,  Ickkyun KIM

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67023 ,  H01L22/10 ,  H01L21/67253

Abstract: An apparatus for processing a substrate may include a chemical liquid discharging part configured to discharge a chemical liquid having a first specific gravity onto a substrate, a chemical liquid supplying part configured to provide the chemical liquid to the chemical liquid discharging part, a fluid supplying part configured to provide a fluid having a second specific gravity different from the first specific gravity, a chemical liquid supplying part configured to provide a chemical liquid having a second specific gravity different from the first specific gravity, and a monitoring port including a trapping part configured to trap the fluid flowing into the chemical liquid supplying part and a sensing part configured to sense an inflow of the fluid. A heat transfer may be generated between the fluid and the chemical liquid such that the chemical liquid has a desired temperature. The fluid may be trapped at a top portion or a bottom portion of the trapping part in accordance with a difference between the first specific gravity and the second specific gravity.