DEVICE FOR SUPPLYING A SOLUTION, APPARATUS FOR PROCESSING A SUBSTRATE AND METHOD OF PROCESSING A SUBSTRATE

    公开(公告)号:US20230207336A1

    公开(公告)日:2023-06-29

    申请号:US18145917

    申请日:2022-12-23

    CPC classification number: H01L21/67023 H01L22/10 H01L21/67253

    Abstract: An apparatus for processing a substrate may include a chemical liquid discharging part configured to discharge a chemical liquid having a first specific gravity onto a substrate, a chemical liquid supplying part configured to provide the chemical liquid to the chemical liquid discharging part, a fluid supplying part configured to provide a fluid having a second specific gravity different from the first specific gravity, a chemical liquid supplying part configured to provide a chemical liquid having a second specific gravity different from the first specific gravity, and a monitoring port including a trapping part configured to trap the fluid flowing into the chemical liquid supplying part and a sensing part configured to sense an inflow of the fluid. A heat transfer may be generated between the fluid and the chemical liquid such that the chemical liquid has a desired temperature. The fluid may be trapped at a top portion or a bottom portion of the trapping part in accordance with a difference between the first specific gravity and the second specific gravity.

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