公开(公告)号：US12138667B2

公开(公告)日：2024-11-12

申请号：US17691215

申请日：2022-03-10

Applicant: SEMES CO., LTD.

Inventor： Shi Hyun Park ,  In Hwang Park ,  Seung Eun Na ,  Eun Woo Jang ,  Kyung Min Kim ,  Je Myung Cha

IPC: H01L21/02 ,  B08B3/08 ,  H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having an inner space therein; a treating container disposed within the inner space and having a treating space; a substrate support unit supporting a substrate in the treating space; a liquid supply unit supplying a liquid to the substrate supported by the substrate support unit; an exhaust unit exhausting a fume generated in the treating space; an airflow supply unit coupled to a top side of the housing and supplying a gas to form a downward airflow to the inner space; and a perforated plate disposed between the treating container and the airflow supply unit and discharging the gas to the inner space, and wherein the perforated plate comprises: a bottom portion and a side portion, the side portion comprising a first side portion, and the first side portion extending and upwardly inclining from the bottom portion to a first sidewall of the housing, and having a first hole for discharging the gas.