公开(公告)号：US20220157565A1

公开(公告)日：2022-05-19

申请号：US17527128

申请日：2021-11-15

Applicant: SEMES CO., LTD.

Inventor： YOUNG KUK KIM ,  TAE HOON JO ,  GOON HO PARK ,  JA MYUNG GU

IPC: H01J37/32

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes: an RF power supply; a process chamber which performs plasma processing by using power applied from the RF power supply; and an impedance matching unit which is disposed between the RF power supply and the process chamber and performs matching, in which the RF power supply includes a first sensor measuring impedance in a direction of the process chamber and the impedance matching unit, and the impedance matching unit performs impedance matching by reflecting impedance measured in the RF power supply through the first sensor.

公开(公告)号：US20210366695A1

公开(公告)日：2021-11-25

申请号：US17323250

申请日：2021-05-18

Applicant: SEMES CO., LTD.

Inventor： OGSEN GALSTYAN ,  JUNPYO LEE ,  GOON HO PARK ,  HYUN-JIN KIM ,  YOUNG-BIN KIM ,  JONG-HWAN AN

IPC: H01J37/32

Abstract: Disclosed is a substrate treating apparatus, which includes a chamber having a space for treating a substrate in an interior thereof, a substrate support assembly including a support plate situated in the chamber and which supports the substrate, a gas supply unit which supplies a gas into the interior of the chamber, a plasma generating unit which excites the gas in in the interior of the chamber into a plasma state, and a substrate temperature control unit which controls a temperature of the substrate, and the substrate temperature control unit includes a plurality of heaters installed in different areas of the support plate, a power supply part which supplies electric power to the plurality of heaters, a ferrite core which interrupts a low-frequency signal introduced to the power supply part, and a plurality of air cores which interrupts a high-frequency signal introduced into the power supply part.