公开(公告)号：US12243847B2

公开(公告)日：2025-03-04

申请号：US17384750

申请日：2021-07-24

Applicant: SEMES CO., LTD.

Inventor： Gil Yong Moon

IPC: H01L23/00 ,  H01L21/67

Abstract: A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit for bonding a chip to the substrate while moving along the gantry, a first temperature sensor installed on the bonding unit and providing a first temperature value of the bonding unit, a second temperature sensor installed at a periphery of the bonding apparatus and providing a second temperature value of an atmospheric temperature at the periphery of the bonding apparatus, and a control part causing the bonding unit to be aligned with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, and determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value.

公开(公告)号：US11705426B2

公开(公告)日：2023-07-18

申请号：US17397854

申请日：2021-08-09

Applicant: SEMES CO., LTD.

Inventor： Gil Yong Moon

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/74 ,  H01L2224/80121 ,  H01L2224/80894

Abstract: A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit configured to bond a chip to the substrate while moving along the gantry, and a control part moving the bonding unit to align the bonding unit with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, determining a movement distance of the bonding unit based on a weighted sum of a number of continuous operations and an idle time of the bonding unit.