SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20250135510A1

    公开(公告)日:2025-05-01

    申请号:US18929782

    申请日:2024-10-29

    Abstract: Disclosed is a substrate treating apparatus including: a substrate support unit for supporting and rotating a substrate; a liquid supply unit for supplying a treatment solution onto the substrate; a collection cup provided to surround the substrate support unit, and having a plurality of collection spaces for collecting a treatment solution scattered from the substrate; a lifting unit for changing a relative position between the collection cup and the substrate; and a controller for controlling the lifting unit to vary a relative height between the substrate and the collection cup in accordance with a process recipe for treating the substrate.

Patent Agency Ranking