公开(公告)号：US20240105498A1

公开(公告)日：2024-03-28

申请号：US18144172

申请日：2023-05-06

Applicant: SEMES CO., LTD.

Inventor： Kyung Taek IM ,  Hwi Jae LEE ,  Kyoung Don LEE

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01L21/67103 ,  H01L21/68742

Abstract: An apparatus for processing a substrate includes a support plate including a first accommodation space having a disk shape disposed therein and supporting a substrate; a first cooling means accommodated in the first accommodation space and including a phase change material; and a second cooling means disposed in the support plate and disposed to have at least a portion of the first cooling means interposed between the second cooling means and an upper surface of the support plate, and including cooling liquid flowing in the support plate.