APPARATUS FOR PROCESSING SUBSTRATE
    1.
    发明公开

    公开(公告)号:US20240105498A1

    公开(公告)日:2024-03-28

    申请号:US18144172

    申请日:2023-05-06

    CPC classification number: H01L21/68785 H01L21/67103 H01L21/68742

    Abstract: An apparatus for processing a substrate includes a support plate including a first accommodation space having a disk shape disposed therein and supporting a substrate; a first cooling means accommodated in the first accommodation space and including a phase change material; and a second cooling means disposed in the support plate and disposed to have at least a portion of the first cooling means interposed between the second cooling means and an upper surface of the support plate, and including cooling liquid flowing in the support plate.

    BAKE UNIT, OPERATION METHOD THEREOF, AND PHOTO SPINNER EQUIPMENT HAVING THE BAKE UNIT

    公开(公告)号:US20240103376A1

    公开(公告)日:2024-03-28

    申请号:US18241892

    申请日:2023-09-03

    CPC classification number: G03F7/40

    Abstract: Proposed is a bake unit capable of rapid thermal treatment, an operation method of the bake unit, and photo spinner equipment. The bake unit that performs a thermal process on a substrate in the photo spinner equipment includes a heater for heating the substrate, a chiller for cooling the substrate, a substrate transfer robot for transferring the substrate, and a controller controlling an operation of the substrate transfer robot. The substrate transfer robot includes an arm base configured to be able to move up and down in a vertical direction, and an upper arm and a lower arm coupled to the arm base to move up and down together but be independently horizontally driven.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20250105026A1

    公开(公告)日:2025-03-27

    申请号:US18810501

    申请日:2024-08-20

    Abstract: An apparatus for processing a substrate includes a heating unit heating the substrate and including a hot plate having a vacuum hole; a fume collection unit including a housing, an inlet portion connected to the vacuum hole and introducing a mixed gas containing fumes generated in heating the substrate within an internal space of the housing, and an outlet portion discharging a gas from which the fumes have been removed to an external space of the housing; a vacuum unit connected to the fume collection unit and vacuum-adsorbing the substrate onto the hot plate when the substrate is heated; and a chilling unit including a cooling body, a coolant inflow fluid passage introducing a coolant into the cooling body, a coolant discharge fluid passage discharging the coolant from the cooling body, and a bypass fluid passage connecting the coolant inflow fluid passage and the coolant discharge fluid passage.

Patent Agency Ranking