公开(公告)号：US20220067905A1

公开(公告)日：2022-03-03

申请号：US17461610

申请日：2021-08-30

Applicant: SEMES CO., LTD.

Inventor： OHYEOL KWON ,  SOO YEON SHIN ,  JIHYUN LEE ,  CHANG YUL CHO

IPC: G06T7/00 ,  G06T3/00 ,  G06T7/50 ,  G06T11/00

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.

公开(公告)号：US20200075362A1

公开(公告)日：2020-03-05

申请号：US16557790

申请日：2019-08-30

Applicant: SEMES CO., LTD.

Inventor： OHYEOL KWON ,  JIHYUN LEE ,  YOUNG HO CHOO

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/687

Abstract: The inventive concept relates to a substrate treating apparatus and method for removing various types of treating liquid or cleaning solution films on an edge region of a substrate without damage to a treated surface even though the substrate is rotated in an eccentric state.