公开(公告)号：US20220406624A1

公开(公告)日：2022-12-22

申请号：US17837135

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： MYUNG SEOK CHA ,  SANG MIN LEE ,  JIN WOO JUNG ,  DO HYEON YOON

IPC: H01L21/67 ,  H01L21/02 ,  C23C16/44

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.