公开(公告)号：US20210257193A1

公开(公告)日：2021-08-19

申请号：US17177135

申请日：2021-02-16

Applicant: SEMES CO., LTD.

Inventor： SOON-CHEON CHO ,  SU HYUNG LEE ,  YOUNGRAN KO ,  JUYONG JANG

IPC: H01J37/32 ,  H01L21/67 ,  B08B7/00 ,  B08B13/00

Abstract: The present invention provides a method and apparatus for cleaning parts used in substrate processing. In a method for cleaning parts of a substrate processing, plasma generated from cleaning gas is supplied together with a cooling medium to clean the parts, but the cooling medium may be provided at a lower temperature than the plasma.