公开(公告)号：US20230343563A1

公开(公告)日：2023-10-26

申请号：US17725000

申请日：2022-04-20

Applicant: SEMES CO., LTD.

Inventor： JIN HEE HONG ,  YUN SANG KIM ,  MIN SUNG JEON ,  SOON-CHEON CHO ,  SUNG MIN CHOI ,  JUNG HOON PARK

IPC: H01J37/32

CPC classification number: H01J37/32568 ,  H01J37/3255 ,  H01J37/32559 ,  H01J2237/334 ,  H01J37/32082 ,  H01L21/67115

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a support unit disposed within the treating space and configured to support a substrate; and a plasma generation unit configured to generate a plasma from a process gas supplied to the treating space; and wherein the plasma generation unit comprises: a bottom electrode member; and a top electrode member opposite to the bottom electrode member, wherein the top electrode member comprises: an electrode plate including an electrode; a first plate made of a different material from the electrode plate; and a second plate, and wherein the second plate, the electrode plate, and the first plate are stacked on one another.

公开(公告)号：US20210257193A1

公开(公告)日：2021-08-19

申请号：US17177135

申请日：2021-02-16

Applicant: SEMES CO., LTD.

Inventor： SOON-CHEON CHO ,  SU HYUNG LEE ,  YOUNGRAN KO ,  JUYONG JANG

IPC: H01J37/32 ,  H01L21/67 ,  B08B7/00 ,  B08B13/00

Abstract: The present invention provides a method and apparatus for cleaning parts used in substrate processing. In a method for cleaning parts of a substrate processing, plasma generated from cleaning gas is supplied together with a cooling medium to clean the parts, but the cooling medium may be provided at a lower temperature than the plasma.