公开(公告)号：US20190043699A1

公开(公告)日：2019-02-07

申请号：US16053417

申请日：2018-08-02

Applicant: SEMES CO., LTD.

Inventor： Jae Hwan CHO ,  Hyung Joon KIM

IPC: H01J37/32 ,  H01L21/67 ,  G01N21/41

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a process chamber having a treatment space in the interior thereof, a support unit located in the process chamber to support a substrate, a gas supply unit configured to supply a process gas into the interior of the process chamber, a plasma generating unit including an upper electrode having a through-hole, through which the process gas flows, and a shower head having a hole, through which the process gas is ejected into the treatment space, and an inspection unit configured to inspect a coupling state of the shower head and the upper electrode while an optical fiber is interposed between the upper electrode and the shower head.