公开(公告)号：US20220091150A1

公开(公告)日：2022-03-24

申请号：US17482845

申请日：2021-09-23

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Sang Hyun SON ,  Ji Su HONG ,  Jae Myoung LEE ,  Dong Ok AHN

IPC: G01P5/12 ,  G01P13/04

Abstract: The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

公开(公告)号：US20210249278A1

公开(公告)日：2021-08-12

申请号：US17244722

申请日：2021-04-29

Applicant: SEMES CO., LTD.

Inventor： Young Hun LEE ,  Jae Myoung LEE

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B08B3/04 ,  B08B3/08 ,  B08B3/14

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that supplies a liquid onto the substrate to liquid-treat the substrate, a drying chamber that removes the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treatment chamber and the drying chamber, wherein the transfer unit includes a hand that supports the substrate, and a weight measuring unit that measures a weight of the remained liquid on the substrate. A weight of a remained liquid on a substrate may be measured by measuring a weight of the substrate while the substrate is transferred.