SUBSTRATE PROCESSING DEVICE AND CONTROL METHOD FOR SUBSTRATE PROCESSING DEVICE

    公开(公告)号:US20230211622A1

    公开(公告)日:2023-07-06

    申请号:US18147910

    申请日:2022-12-29

    CPC classification number: B41M5/0047 B41J2/015 C09D11/30

    Abstract: Disclosed is a substrate processing device which includes a substrate transfer part on which a transfer object is received and a jetting system part includes an ink jet body that jets and prints ink on the transfer object over an upper surface of the substrate transfer part, an ink module transfer part that transfers the ink jet body, an encoder disposed around the ink module transfer part to output a movement signal per unit movement distance of the ink module transfer part, an ink ejection controller that interworks with the ink jet body to control an ink jetting timing of the ink jet body, and a signal splitter that interworks with the encoder to count the movement signal, reset a width of the counted movement signal, and transmit the movement signal, the width of which is reset, to the ink ejection controller.

    WIRELESS SENSOR DEVICE, HOST DEVICE, AND METHOD OF CONTROLLING LOW-POWER OPERATION OF WIRELESS SENSOR DEVICE

    公开(公告)号:US20220060867A1

    公开(公告)日:2022-02-24

    申请号:US17085913

    申请日:2020-10-30

    Abstract: A method of controlling a low-power operation of a wireless sensor device includes performing a sensor-active step where the wireless sensor device is active during the time taken for a working mode in which the wireless sensor device performs multiple tasks, and performing a sensor-inactive step where a mode of the wireless sensor device is switched to a sleep mode after the working mode is ended. The performing of the sensor-active step includes receiving, after transmitting sensing data of a sensing target to a host device that monitors and controls the wireless sensor device, operation control information stored in the host device from the host device.

    APPARATUS FOR TEMPERATURE MEASUREMENT AND METHOD OF PROCESSING SUBSTRATE

    公开(公告)号:US20230083574A1

    公开(公告)日:2023-03-16

    申请号:US17737354

    申请日:2022-05-05

    Abstract: A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.

    COMPUTING RESOURCE MANAGEMENT SYSTEM AND METHOD USING SOFTWARE MODULARIZATION

    公开(公告)号:US20240160486A1

    公开(公告)日:2024-05-16

    申请号:US18380656

    申请日:2023-10-17

    CPC classification number: G06F9/5038 G06F9/5072 G06F2209/503 G06F2209/505

    Abstract: A computing resource management system using software modularization in a cluster computing environment in which computing devices are connected, including an application process running on each computing device and an algorithm processing process configured to run independently of the application process and perform task processing on the application process, the computing resource management system including: a task managing system configured to receive a task request message from an application process requiring a task from each computing device; a process managing system configured to confirm an algorithm processing process of computing devices connected to the cluster computing environment, and determine whether there is an algorithm processing process in an idle state to which the application process requested for a task will be assigned; and a performed managing system configured to confirm a result of an application process whose task is performed by the algorithm processing process.

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