公开(公告)号：US20230369029A1

公开(公告)日：2023-11-16

申请号：US18298551

申请日：2023-04-11

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu SON ,  Jaewoong Sim ,  Donguk Kim ,  Yunsang Kim ,  Inhoe Kim

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/32697 ,  H01J37/32724 ,  H01J37/32082 ,  H01J2237/002 ,  H01J2237/2007

Abstract: A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.