公开(公告)号：US10964557B2

公开(公告)日：2021-03-30

申请号：US16051059

申请日：2018-07-31

Applicant: SEMES CO., LTD.

Inventor： Do Yeon Kim ,  Jin Kyu Kim ,  Yoon Jong Ju ,  Min Sung Han ,  Joon Ho Won ,  Yong Tak Hyun

IPC: H01L21/67 ,  H01L21/687

Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.