-
公开(公告)号：US10964557B2
公开(公告)日：2021-03-30
申请号：US16051059
申请日：2018-07-31
Applicant: SEMES CO., LTD.
Inventor： Do Yeon Kim , Jin Kyu Kim , Yoon Jong Ju , Min Sung Han , Joon Ho Won , Yong Tak Hyun
IPC: H01L21/67 , H01L21/687
Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.
-
公开(公告)号：US11940734B2
公开(公告)日：2024-03-26
申请号：US17726343
申请日：2022-04-21
Applicant: SEMES CO., LTD.
Inventor： Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
-
公开(公告)号：US20230341779A1
公开(公告)日：2023-10-26
申请号：US17726343
申请日：2022-04-21
Applicant: SEMES CO., LTD.
Inventor： Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
-
-
Search Results
3
records
(took 0.015 seconds)
