公开(公告)号：US20250166987A1

公开(公告)日：2025-05-22

申请号：US18954889

申请日：2024-11-21

Applicant: SEMES CO., LTD.

Inventor： Yong Jun KIM ,  Tae Keun KIM ,  Kang Sul KIM ,  Jun Hee CHOI ,  Kyeong Min LEE

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  B08B5/00

Abstract: Disclosed is a method of treating a substrate, the method including: a liquid treatment operation of treating a substrate by supplying a treatment solution to a rotating substrate to form a liquid film on the substrate; after the liquid treatment operation, a gas treatment operation of discharging gas to the substrate and removing an upper layer of the liquid film from the substrate; and after the gas treatment operation, a liquid film removal operation of removing a lower layer in the liquid film on the substrate.

公开(公告)号：US20250140576A1

公开(公告)日：2025-05-01

申请号：US18921283

申请日：2024-10-21

Applicant: SEMES CO., LTD.

Inventor： Jun Hee CHOI ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Yong Jun KIM ,  Hyeong Soo PARK

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/304

Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.