公开(公告)号：US20240178010A1

公开(公告)日：2024-05-30

申请号：US18242003

申请日：2023-09-05

Applicant: SEMES CO., LTD.

Inventor： Kang Sul KIM ,  Tae Keun KIM ,  Kyeong Min LEE

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: A liquid supply apparatus is provided. The liquid supply apparatus includes: a base unit having an operating space, an inlet port, through which a treatment liquid is introduced, and an outlet port, through which the treatment liquid is discharged, formed therein; bellows having the operating space formed on its outside within the base unit, including an inlet and an outlet, which form ends of the inlet and outlet ports, respectively, of the base unit and communicate to create a storage space that the treatment liquid flows in and out of, and expanding or contracting to increase or reduce the volume of the storage space; an operating unit supplying operating fluid into or discharging the operating fluid from the operating space; and a drain line communicating with the storage space, from below the base unit, and discharging the treatment liquid, wherein the operating unit supplies the operating fluid into the operating space to enable the bellows to contract, or discharges the operating fluid from the operating space to enable the bellows to expand, and the drain line discharges residual treatment liquid remaining in the storage space to replace the treatment liquid.

公开(公告)号：US20230170229A1

公开(公告)日：2023-06-01

申请号：US17879785

申请日：2022-08-03

Applicant: SEMES CO, LTD.

Inventor： Kyeong Min LEE ,  Tae Keun KIM ,  Kang Sul KIM ,  Min Hee CHO ,  Won Young KANG

IPC: H01L21/67 ,  C23C14/58 ,  C23C14/50

CPC classification number: H01L21/67051 ,  C23C14/5873 ,  C23C14/505

Abstract: Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.

公开(公告)号：US20190241844A1

公开(公告)日：2019-08-08

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun PARK ,  Jung-Min OH ,  Young-Hoo KIM ,  Hyo San LEE ,  Tae Keun KIM ,  Ye Rim YEON ,  Hae Rim OH ,  Ji Soo JEONG ,  Min Hee CHO

IPC: C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/10 ,  C11D17/00 ,  C11D1/14 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D3/28

CPC classification number: C11D11/0047 ,  B08B3/10 ,  C11D1/146 ,  C11D3/201 ,  C11D3/2017 ,  C11D3/2044 ,  C11D3/2096 ,  C11D3/28 ,  C11D3/32 ,  C11D3/3445 ,  C11D17/0008 ,  H01L21/02057 ,  H01L21/67051 ,  H01L21/68764

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.035.

公开(公告)号：US20160013080A1

公开(公告)日：2016-01-14

申请号：US14749010

申请日：2015-06-24

Applicant: Semes Co., Ltd.

Inventor： Tae Keun KIM ,  Oh Jin KWON ,  Ki Hoon CHOI

IPC: H01L21/67 ,  B08B3/10 ,  B08B3/02

CPC classification number: B08B3/10 ,  B08B3/12 ,  B08B7/028 ,  H01L21/67017 ,  H01L21/67051

Abstract: Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.

Abstract translation: 本发明构思的实施例提供了一种用于处理基底的装置和方法。 该装置包括支撑基板的基板支撑单元和向由基板支撑单元支撑的基板供应处理溶液的液体供应单元。 液体供给单元包括将处理液排出到基板的喷嘴，向喷嘴供给处理液的液体供给管线，安装在液体供给管线上的混合部件，形成在混合部件内的混合空间和气体供给部 线路连接到混合构件以将气体供应到混合空间中。 混合构件包括形成混合空间的主体和与主体结合的流入口，使得通过流入口供应的气体与混合空间中的处理溶液混合以形成纳米级气泡。

公开(公告)号：US20250166987A1

公开(公告)日：2025-05-22

申请号：US18954889

申请日：2024-11-21

Applicant: SEMES CO., LTD.

Inventor： Yong Jun KIM ,  Tae Keun KIM ,  Kang Sul KIM ,  Jun Hee CHOI ,  Kyeong Min LEE

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  B08B5/00

Abstract: Disclosed is a method of treating a substrate, the method including: a liquid treatment operation of treating a substrate by supplying a treatment solution to a rotating substrate to form a liquid film on the substrate; after the liquid treatment operation, a gas treatment operation of discharging gas to the substrate and removing an upper layer of the liquid film from the substrate; and after the gas treatment operation, a liquid film removal operation of removing a lower layer in the liquid film on the substrate.

公开(公告)号：US20250140576A1

公开(公告)日：2025-05-01

申请号：US18921283

申请日：2024-10-21

Applicant: SEMES CO., LTD.

Inventor： Jun Hee CHOI ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Yong Jun KIM ,  Hyeong Soo PARK

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/304

Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.

公开(公告)号：US20230215740A1

公开(公告)日：2023-07-06

申请号：US17843919

申请日：2022-06-17

Applicant: SEMES CO., LTD.

Inventor： Won Young KANG ,  Tae Keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Min Hee CHO

IPC: H01L21/67 ,  B08B3/10 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/10 ,  H01L21/68764 ,  H01L21/02057

Abstract: There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.