公开(公告)号：US20240412989A1

公开(公告)日：2024-12-12

申请号：US18737916

申请日：2024-06-07

Applicant: SEMES CO., LTD.

Inventor： Young Eun JEON ,  Jong Won PARK ,  Sung Min CHOI ,  Woo Nam CHOI ,  Kun Hee KO ,  Yu Jung PARK ,  Jung Min SIM

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/324 ,  H01L21/687

Abstract: Proposed are thermal processing apparatus, thermal processing method, and substrate treatment equipment, in which particle generation and damage to a substrate in the cooling process of the substrate can be prevented. The thermal processing apparatus includes a chamber having a processing zone therein, a plurality of chuck pins configured to support a substrate and move up or down individually, a heater configured to provide heat energy to the processing zone, a fluid supply port configured to supply a fluid to the processing zone, a fluid discharge port configured to discharge the fluid remaining in the processing zone to the outside, and a controller configured to control a treatment process of the substrate.