公开(公告)号：US20230152706A1

公开(公告)日：2023-05-18

申请号：US17988811

申请日：2022-11-17

Applicant: SEMES CO., LTD.

Inventor： KI HOON CHOI ,  HYO WON YANG ,  HYUN YOON ,  TAE HEE KIM ,  WON SIK SON ,  IN KI JUNG

IPC: G03F7/20

CPC classification number: G03F7/70025

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support and rotate a substrate at a treating space; a liquid supply unit configured to supply a liquid to the substrate supported at the support unit; a housing having an installation space; a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to a substrate supported on the support unit; and a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space, and wherein an opening is formed at a bottom end of the cover to overlap the laser light irradiated from the irradiation end when seen from above.