公开(公告)号：US20230152706A1

公开(公告)日：2023-05-18

申请号：US17988811

申请日：2022-11-17

Applicant: SEMES CO., LTD.

Inventor： KI HOON CHOI ,  HYO WON YANG ,  HYUN YOON ,  TAE HEE KIM ,  WON SIK SON ,  IN KI JUNG

IPC: G03F7/20

CPC classification number: G03F7/70025

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support and rotate a substrate at a treating space; a liquid supply unit configured to supply a liquid to the substrate supported at the support unit; a housing having an installation space; a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to a substrate supported on the support unit; and a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space, and wherein an opening is formed at a bottom end of the cover to overlap the laser light irradiated from the irradiation end when seen from above.

公开(公告)号：US20220059309A1

公开(公告)日：2022-02-24

申请号：US17409840

申请日：2021-08-24

Applicant: SEMES CO., LTD.

Inventor： DOYEON KIM ,  HYUN YOON ,  Ho Jong Hwang

IPC: H01J37/02 ,  H01J37/317 ,  H01J37/20 ,  H01L21/687

Abstract: An apparatus for treating a substrate includes a process chamber that performs a liquid treatment process by dispensing a treatment liquid onto the substrate, and components provided in the process chamber. A surface of at least one of the components is formed of a material containing an ion-implanted fluorine resin.