SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    1.
    发明申请
    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号:US20130318815A1

    公开(公告)日:2013-12-05

    申请号:US13905754

    申请日:2013-05-30

    Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.

    Abstract translation: 提供了一种使用超临界流体处理基板的装置。 基板处理装置包括壳体,设置在壳体内以支撑基板的支撑构件,超临界流体供应单元,超临界流体被储存在该超临界流体供应单元中,供应管将超临界流体供应单元连接到壳体以调节 从超临界流体供给单元供给到壳体中的超临​​界流体和从供给管分支以排出残留在供给管中的超临界流体的通气管。 打开或关闭排气管的切换阀设置在排气管中。

Patent Agency Ranking