公开(公告)号：US20240186167A1

公开(公告)日：2024-06-06

申请号：US18507439

申请日：2023-11-13

Applicant: SEMES CO., LTD.

Inventor： Kyungsik SHIN ,  Seunghwan LEE ,  Kyoungdon LEE

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68 ,  H01L21/67098 ,  H01L21/67778

Abstract: An apparatus for processing a substrate may include a substrate holding part configured to maintain and support a substrate, a substrate transfer part configured to load the substrate onto the substrate holding part and to unload the substrate from the substrate holding part, and a substrate processing part configured to heat the substrate or to cool the substrate. The substrate holding part may include a plate configured to maintain and support the substrate, guide parts configured to move the substrate into a central region of the plate, and an alignment part configured to move the guide parts toward the central region of the plate utilizing a vacuum suction mechanism.