公开(公告)号：US20240134292A1

公开(公告)日：2024-04-25

申请号：US18377300

申请日：2023-10-04

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

公开(公告)号：US20240231246A9

公开(公告)日：2024-07-11

申请号：US18377300

申请日：2023-10-05

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.