公开(公告)号：US20240231246A9

公开(公告)日：2024-07-11

申请号：US18377300

申请日：2023-10-05

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

公开(公告)号：US20230408200A1

公开(公告)日：2023-12-21

申请号：US18143273

申请日：2023-05-04

Applicant: SEMES CO., LTD.

Inventor： Ju Mi LEE ,  Gyeong Won SONG ,  Min Hee CHO ,  Byung Hwi KIM ,  Chun Woo PARK ,  Hee Man AHN

IPC: F27D9/00 ,  G03F7/40

CPC classification number: F27D9/00 ,  G03F7/40 ,  F27D2009/0078

Abstract: The substrate processing apparatus of the present invention comprises a hot plate for heating a substrate; and a cooling unit for cooling the hot plate; wherein the cooling unit includes a support plate having a space formed between the support plate and the hot plate, and a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate, wherein an outdoor air inlet passage provided in a through structure is provide in the support plate, wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.

公开(公告)号：US20240222165A1

公开(公告)日：2024-07-04

申请号：US18539634

申请日：2023-12-14

Applicant: SEMES CO., LTD.

Inventor： Hee Man AHN ,  Gyeong Won SONG ,  Min Hee CHO ,  Ju Mi LEE ,  Byung Hwi KIM ,  Chun Woo PARK

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67225 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67098 ,  H01L21/67742

Abstract: The inventive concept provides a substrate treating apparatus which is cool a support plate having a heater faster than a conventional substrate treating apparatus. The substrate treating apparatus includes a housing providing a treating space therein; and a support unit configured to support a substrate at the treating space. The support unit includes a heater member provided at the support plate to heat the substrate and a cooling unit configured to cool the heater member. The cooling unit includes a first gas supply nozzle positioned under an edge of the heater member for supplying a cooling gas to a center direction of a bottom surface of the heater member and a second gas supply nozzle positioned under a center of the heater member for supplying the cooling gas in an edge direction of the bottom surface of the heater member.

公开(公告)号：US20240134292A1

公开(公告)日：2024-04-25

申请号：US18377300

申请日：2023-10-04

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

公开(公告)号：US20230063639A1

公开(公告)日：2023-03-02

申请号：US17898459

申请日：2022-08-29

Applicant: SEMES CO., LTD.

Inventor： Gyeong Won SONG ,  Jae Seong LEE ,  Chun Woo PARK

IPC: B05D3/02

Abstract: Provided is a heat treatment unit, including: a chamber providing a substrate processing apparatus including: a process chamber in which an upper chamber and a lower chamber are in contact with each other to form a treatment space defined by the upper chamber and the lower chamber; a heating plate positioned in the treatment space to heat a substrate; a lift pin for placing the substrate on the heating plate or for moving the substrate placed on the heating plate to be spaced apart from the heating plate; a driving member connected to the upper chamber or the lower chamber to vertically drive the upper chamber or the lower chamber; an exhaust member connected to a central region of the upper chamber to exhaust the treatment space; and an airflow blocking member provided on an upper surface of the heating plate and formed to surround an edge of the substrate so as to block a surrounding airflow from approaching the edge of the substrate.