公开(公告)号：US20240134292A1

公开(公告)日：2024-04-25

申请号：US18377300

申请日：2023-10-04

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

公开(公告)号：US20240231246A9

公开(公告)日：2024-07-11

申请号：US18377300

申请日：2023-10-05

Applicant: SEMES CO., LTD.

Inventor： Minhee CHO ,  Hee Man AHN ,  Gyeong Won SONG ,  Jumi LEE ,  Chun Woo PARK ,  Byung Hwi KIM

IPC: G03F7/00

CPC classification number: G03F7/70875

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

公开(公告)号：US20240194517A1

公开(公告)日：2024-06-13

申请号：US18515638

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jumi LEE ,  Minyoung KIM ,  Jong Gun LEE

IPC: H01L21/687 ,  G03F7/40 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/6875 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/6838 ,  H01L21/68742

Abstract: Disclosed is a substrate processing apparatus that allows a substrate to be supported on an ultra-thin heating plate so as to be spaced from the ultra-thin heating plate in a proximity manner. The substrate processing apparatus includes a heating plate for heating a substrate; and a through proximity pin installed in the heating plate so as to pass through a through-hole formed in the heating plate such that the substrate is spaced from the heating plate by a spacing via the through proximity pin.