公开(公告)号：US10711228B2

公开(公告)日：2020-07-14

申请号：US16028720

申请日：2018-07-06

Applicant: SEMES CO., LTD.

Inventor： Mong-Ryong Lee ,  Miyoung Jo ,  Yerim Yeon ,  Anton Koriakin

IPC: C11D11/00 ,  C11D17/00 ,  C11D3/43 ,  C11D3/37

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a support member which supports a substrate; a treatment liquid discharging member which discharges a treatment liquid containing a monomeric substance to the substrate located in the support member; and a light irradiator which irradiates light to the treatment liquid discharged to the substrate.