公开(公告)号：US10777458B2

公开(公告)日：2020-09-15

申请号：US15841518

申请日：2017-12-14

Applicant: SEMES CO., LTD.

Inventor： Yoon Ki Sa ,  Mong Ryong Lee

IPC: H01L21/768 ,  C25D13/12 ,  H01L23/48 ,  H01L21/288

Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.

公开(公告)号：US20180182669A1

公开(公告)日：2018-06-28

申请号：US15841518

申请日：2017-12-14

Applicant: SEMES CO., LTD.

Inventor： Yoon Ki SA ,  Mong Ryong Lee

IPC: H01L21/768 ,  H01L21/288 ,  H01L23/48 ,  C25D13/12

Abstract: A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a via hole formed in the substrate, forming an electric field through the substrate to fill the via hole with the filling material, and solidifying the filling material in the via hole. The apparatus includes a stage for supporting the substrate, upper and lower electrodes for forming the electric field, and a power supply connected with the upper and lower electrodes.