TEMPERATURE ADJUSTMENT APPARATUS
    1.
    发明申请

    公开(公告)号:US20220197318A1

    公开(公告)日:2022-06-23

    申请号:US17554625

    申请日:2021-12-17

    Abstract: A temperature adjustment apparatus configured to perform temperature adjustment and control for each fine zone of a substrate, a multi-zone temperature adjustment apparatus including the same, and a multi-zone temperature adjustment type substrate supporting apparatus are proposed. The temperature adjustment apparatus includes a first power source, a second power source, an ammeter connected to the second power source in series and configured to measure a current value of the second power source, a heater inducing a first direction current to dissipate heat energy while being connected to the first power source in series during a heating time period, a temperature sensor inducing a second direction current while being connected to the second power source in series during a sensing time period, and a switch controller controlling connection between the first power source and the heater and connection between the second power source and the temperature sensor.

    CONTROLLING APPARATUS FOR CONTROLLING OPERATION OF SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20220206467A1

    公开(公告)日:2022-06-30

    申请号:US17561649

    申请日:2021-12-23

    Inventor: Sang Bo SEO

    Abstract: A controlling apparatus for controlling operation of a substrate processing apparatus includes a first CTC, and a second CTC. When the first CTC stops operating, the second CTC is preset to control each module in the substrate processing apparatus in place of the first CTC. As the first CTC and the second CTC are dualized to provide the controlling apparatus, even when one of the CTCs stops operating, another dualized CTC is used to control the substrate processing apparatus, so that operation-stop of the substrate processing system is prevented and entire process efficiency is increased.

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