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1.发明公开公开(公告)号：US20240222099A1
公开(公告)日：2024-07-04
申请号：US18541437
申请日：2023-12-15
Applicant: SEMES CO., LTD.
Inventor： Yun Sik JU , Chung Woo LEE
IPC: H01J37/32 , H01L21/683
CPC classification number: H01J37/32935 , H01J37/32724 , H01L21/6833 , H01J2237/24564 , H01J2237/24585
Abstract: The inventive concept provides a control method for controlling a support unit. The support unit includes a support plate on which a substrate is placed; a first heater installed on the support plate; and a second heater installed on the support plate at a different height from the first heater, and the control method includes: determining whether a temperature of the first heater has reached a normal state after the temperature of the first heater varies; measuring a resistance of the second heater after the temperature of the first heater has reached the normal state; and calculating a compensation factor for estimating a temperature of the second heater based on the resistance of the second heater which has been measured.
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公开(公告)号：US20230075120A1
公开(公告)日：2023-03-09
申请号：US17895212
申请日：2022-08-25
Applicant: SEMES CO., LTD.
Inventor： Tae Dong PARK , Chung Woo LEE
Abstract: Provided is a supporting unit supporting a substrate. The supporting unit may include: a plate; heating elements provided to the plate and controlling a temperature of a substrate, wherein the heating elements are arranged to control temperatures of different areas of the substrate; and a power supply module supplying power to the heating element, and the power supply module may be configured to continuously supply the power to at least two heating elements of the heating elements.
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公开(公告)号：US20230084162A1
公开(公告)日：2023-03-16
申请号：US17872922
申请日：2022-07-25
Applicant: SEMES CO., LTD.
Inventor： Sung Hyuk JUNG , Chung Woo LEE
Abstract: A substrate transfer assembly that transfers a substrate includes a robot arm configured to transfer the substrate, a laser disposed at the robot arm and emitting one or more rays of light, an image sensor disposed at the robot arm and generating a photographed picture or video including an image of a front object by the one or more emitted rays of light, and a control circuit configured to control transfer of the substrate based on the image present in the photographed picture or video.
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公开(公告)号：US20220384160A1
公开(公告)日：2022-12-01
申请号：US17825561
申请日：2022-05-26
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE
Abstract: Disclosed is a container that receives a substrate type sensor. The container includes a body having a reception space, one side of which is opened, a door that selectively opens and closes the reception space, a shelf part that supports the substrate type sensor in the reception space, and a charging module that charges the substrate type sensor supported by the shelf part, and the charging module includes a charging part that moves between a standby location and a charging location that charges the substrate type sensor supported by the shelf part.
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公开(公告)号：US20230070679A1
公开(公告)日：2023-03-09
申请号：US17895266
申请日：2022-08-25
Applicant: SEMES CO., LTD.
Inventor： Tae Dong PARK , Chung Woo LEE
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; and a support unit configured to support and heat a substrate in the treating space, and wherein the support unit includes: at least one heating element for adjusting a temperature of the substrate; a power source for generating a power applied to at least one heating element; a power supply line for transmitting the power generated by the power source to the at least one heating element; a power return line for grounding the at least one heating element; and a current measuring resistor provided on the power supply line or the power return line and used for estimating a temperature of the at least one heating element.
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Patent Agency Ranking
公开(公告)号：US20230067873A1
公开(公告)日：2023-03-02
申请号：US17890395
申请日：2022-08-18
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE , Chang Jun PARK , Tae Dong PARK
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an entrance for taking in and taking out a substrate at a side wall; a support unit provided inside of the chamber and supporting the substrate; an imaging unit for imaging a substrate being taken in by a transfer robot through the entrance; and a controller is configured to control a position of the transfer robot based on an image data from the imaging unit.
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公开(公告)号：US20230029721A1
公开(公告)日：2023-02-02
申请号：US17870283
申请日：2022-07-21
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE
IPC: H01L21/683 , H01J37/32 , H05B1/02 , H05B3/22
Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a heating unit for heating the substrate, and wherein the heating unit includes: a plurality of heating members; and a plurality of first power lines and a plurality of second power lines providing a supply and return pathway for a power to and from the plurality of heating members, and wherein the plurality of second power lines are connected to each of the plurality of first power lines through the plurality of heating members, and at least two heating members are connected to each first power line and at least two heating members are connected to each second power line, and at least two heating members are connected in parallel between each first power line and each second power line.
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公开(公告)号：US20220197318A1
公开(公告)日：2022-06-23
申请号：US17554625
申请日：2021-12-17
Applicant: SEMES CO., LTD.
Inventor： Sang Bo SEO , Soo Hyang KANG , Young Chul SHIN , Chung Woo LEE
Abstract: A temperature adjustment apparatus configured to perform temperature adjustment and control for each fine zone of a substrate, a multi-zone temperature adjustment apparatus including the same, and a multi-zone temperature adjustment type substrate supporting apparatus are proposed. The temperature adjustment apparatus includes a first power source, a second power source, an ammeter connected to the second power source in series and configured to measure a current value of the second power source, a heater inducing a first direction current to dissipate heat energy while being connected to the first power source in series during a heating time period, a temperature sensor inducing a second direction current while being connected to the second power source in series during a sensing time period, and a switch controller controlling connection between the first power source and the heater and connection between the second power source and the temperature sensor.
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公开(公告)号：US20240210959A1
公开(公告)日：2024-06-27
申请号：US18395973
申请日：2023-12-26
Applicant: SEMES CO., LTD.
Inventor： Se Won KIM , Chung Woo LEE , Ji Won CHA
Abstract: The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated center coordinate value of the support unit as a center coordinate value of the measurement unit, to set a calculated center coordinate value of the substrate as a center coordinate value of a transfer robot, to record the center coordinate value of the transfer robot on a plane coordinate system of the measurement unit, and to convert a recorded center coordinate value of the transfer robot and a center coordinate value of the measurement unit to a plane coordinate system of the transfer robot to teach the transfer robot.
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10.发明公开公开(公告)号：US20230194239A1
公开(公告)日：2023-06-22
申请号：US18082572
申请日：2022-12-15
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE , Tae Dong PARK , Chang Jun PARK , Jin Hwan KIM
CPC classification number: G01B11/002 , H01L21/67259 , G01B11/14 , H01L21/6831
Abstract: Proposed are a wafer position detection apparatus and a wafer position detection and correction method using the same. More specifically, proposed is an apparatus for wafer placement teaching for adjusting a position of a wafer disposed on an electrostatic chuck, the apparatus including a laser distance sensor disposed above the electrostatic chuck, and a controller configured to control a robot configured to transfer the wafer. The controller checks a relative position of the electrostatic chuck and the wafer disposed on the electrostatic chuck using the laser distance sensor so that the wafer is transferred to a predetermined position, and teaches the position of the wafer using the checked relative position of the electrostatic chuck and the wafer.
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