公开(公告)号：US11244847B2

公开(公告)日：2022-02-08

申请号：US16174683

申请日：2018-10-30

Applicant: SEMES CO., LTD.

Inventor： Harutyun Melikyan ,  Jong Hwan An ,  Jamyung Gu ,  Sang-Kee Lee ,  Young Bin Kim ,  Shin-Woo Nam

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/66 ,  H01J37/32 ,  H01J37/244 ,  H01L21/67

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treatment space in the interior thereof, a support unit configured to support a substrate in the treatment space, a gas supply unit configured to supply a gas into the treatment space, and a plasma generating unit configured to generate plasma from the gas, wherein the support unit includes an electrostatic chuck including an upper body having a support surface that suctions the substrate and a lower body extending from the upper body to a lower side, wherein the lower body has an extension part extending laterally from the upper body, a focus ring disposed on the extension part of the electrostatic chuck, and a metallic ring provided between the upper body of the electrostatic chuck and the focus ring and configured to control plasma in an extreme edge of the substrate.

公开(公告)号：US20210020488A1

公开(公告)日：2021-01-21

申请号：US16924519

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： So Hyung Jiong ,  Sang-Kee Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: Provided are a wafer support unit, in which a dam is installed outside an O-ring to prevent the O-ring from being etched, and a wafer treatment system including the wafer support unit. The wafer treatment system includes: a housing; a shower head introduces a process gas for etching a wafer into the housing; and a support unit includes an electrostatic chuck on which the wafer is mounted, a base supporting the electrostatic chuck, and a focus ring installed on side surfaces of the electrostatic chuck, wherein the support unit includes: a fixing component which fixes the focus ring to the base; a sealing component which is disposed between the focus ring and the base to seal a circumference of a fastening component; and a dam component which is installed outside the sealing component to prevent the sealing component from being etched by the process gas.

公开(公告)号：US11056367B2

公开(公告)日：2021-07-06

申请号：US16546104

申请日：2019-08-20

Applicant: SEMES CO., LTD.

Inventor： Dukhyun Son ,  Sang-Kee Lee

IPC: H01L21/673 ,  H01L21/683

Abstract: Embodiments of the inventive concept provide an apparatus and method for storing a substrate. A buffer unit for storing a substrate includes a housing having an entrance formed at one side and a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. At least one of the gas supply line and the gas exhaust line includes a plurality of lines.

公开(公告)号：US20210027995A1

公开(公告)日：2021-01-28

申请号：US16924516

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： Dongmok Lee ,  Sang-Kee Lee

IPC: H01J37/32 ,  H01L21/3065

Abstract: Provided is a focus ring and a substrate treating apparatus having the focus ring. The substrate treating apparatus includes a process chamber for providing a process treating space for a substrate, a chuck for supporting the substrate and a focus ring arranged to surround an edge of the chuck, wherein the focus ring includes a plurality of layers having different properties, wherein a bonding surface between the plurality of layers is formed in a predetermined pattern.

公开(公告)号：US11056320B2

公开(公告)日：2021-07-06

申请号：US16653626

申请日：2019-10-15

Applicant: SEMES CO., LTD.

Inventor： Sang-Kee Lee ,  Kang Rae Ha

IPC: H01J37/32

Abstract: An apparatus comprises a housing having a process space, a support unit supporting the substrate in the process space, a process gas supply unit supplying a process gas into the process space, and a plasma source generating plasma from the process gas. The support unit comprises a support member on which the substrate is placed, a heating member that heats the substrate supported on the support member, and a heat transfer gas supply member that supplies a heat transfer gas to a backside of the substrate. The heating member comprises heaters that heat regions on the substrate on the support member viewed from above. The support member comprises a protrusion that partitions a space between the support member and the backside of the substrate placed on the support member into gas regions, and at least one of heating regions is divided into regions by the protrusion viewed from above.

公开(公告)号：US20190131159A1

公开(公告)日：2019-05-02

申请号：US16174683

申请日：2018-10-30

Applicant: SEMES CO., LTD.

Inventor： Harutyun Melikyan ,  Jong Hwan An ,  Jamyung Gu ,  Sang-Kee Lee ,  Young Bin Kim ,  Shin-Woo Nam

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/66 ,  H01J37/32 ,  H01J37/244

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treatment space in the interior thereof, a support unit configured to support a substrate in the treatment space, a gas supply unit configured to supply a gas into the treatment space, and a plasma generating unit configured to generate plasma from the gas, wherein the support unit includes an electrostatic chuck including an upper body having a support surface that suctions the substrate and a lower body extending from the upper body to a lower side, wherein the lower body has an extension part extending laterally from the upper body, a focus ring disposed on the extension part of the electrostatic chuck, and a metallic ring provided between the upper body of the electrostatic chuck and the focus ring and configured to control plasma in an extreme edge of the substrate.