Buffer unit, and apparatus for treating substrate with the unit

    公开(公告)号:US11056367B2

    公开(公告)日:2021-07-06

    申请号:US16546104

    申请日:2019-08-20

    申请人: SEMES CO., LTD.

    IPC分类号: H01L21/673 H01L21/683

    摘要: Embodiments of the inventive concept provide an apparatus and method for storing a substrate. A buffer unit for storing a substrate includes a housing having an entrance formed at one side and a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. At least one of the gas supply line and the gas exhaust line includes a plurality of lines.

    Buffer unit, and apparatus and method for treating substrate with the unit

    公开(公告)号:US11569110B2

    公开(公告)日:2023-01-31

    申请号:US16540859

    申请日:2019-08-14

    申请人: SEMES CO., LTD.

    发明人: Dukhyun Son

    摘要: A buffer unit for storing a substrate includes a housing having a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. The controller controls the pressure adjustment unit to maintain the buffer space in a selected one of a filling mode in which the buffer space is filled with the gas and an exhaust mode in which the buffer space is evacuated.

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明公开

    公开(公告)号:US20230317436A1

    公开(公告)日:2023-10-05

    申请号:US18192304

    申请日:2023-03-29

    申请人: Semes Co., Ltd.

    摘要: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.

    Apparatus and method for processing substrate

    公开(公告)号:US11756817B2

    公开(公告)日:2023-09-12

    申请号:US16811133

    申请日:2020-03-06

    申请人: Semes Co., Ltd

    摘要: The inventive concept provides an apparatus and method for processing a substrate. The apparatus includes an index module and a processing module that is disposed adjacent to the index module and that processes the substrate. The index module includes one or more load ports, on each of which a carrier having the substrate received therein is placed, a side storage that stores the substrate subjected to a process in the processing module and removes fumes on the substrate, and a transfer frame including an index robot that transfers the substrate between the carrier placed on the load port, the side storage, and the processing module. The side storage includes a housing having an interior space, a partitioning unit that partitions the interior space into a plurality of receiving spaces independent of one another, and an exhaust unit that independently and separately evacuates the plurality of receiving spaces.

    Apparatus and method for treating substrate

    公开(公告)号:US11295936B2

    公开(公告)日:2022-04-05

    申请号:US16793028

    申请日:2020-02-18

    申请人: Semes Co., Ltd

    摘要: The substrate treating apparatus includes a processing module and an index module on which a cassette having the substrate received therein is placed and that includes an index robot that transfers the substrate between the cassette and the processing module. The processing module includes a process chamber and a transfer chamber. The process chamber includes a support unit. The support unit includes a support on which the substrate is placed and a ring member that surrounds the substrate placed on the support and that is provided so as to be detachable from the support. The apparatus further includes a carrier storage unit that stores a carrier that is mounted on a hand of the main transfer robot or the index robot and on which the ring member is placed when the ring member is transferred by the main transfer robot or the index robot.