公开(公告)号：US20240210959A1

公开(公告)日：2024-06-27

申请号：US18395973

申请日：2023-12-26

Applicant: SEMES CO., LTD.

Inventor： Se Won KIM ,  Chung Woo LEE ,  Ji Won CHA

IPC: G05D1/622 ,  G05D1/243 ,  G06T7/13 ,  G06T7/73

CPC classification number: G05D1/637 ,  G05D1/243 ,  G06T7/13 ,  G06T7/74 ,  H04N23/56

Abstract: The substrate treating apparatus includes an analysis part configured to communicate with a measurement unit to be input with an information with respect to a boundary, to calculate a center coordinate value of a substrate and a center coordinate value of a support unit with an input information on the boundary, to set a calculated center coordinate value of the support unit as a center coordinate value of the measurement unit, to set a calculated center coordinate value of the substrate as a center coordinate value of a transfer robot, to record the center coordinate value of the transfer robot on a plane coordinate system of the measurement unit, and to convert a recorded center coordinate value of the transfer robot and a center coordinate value of the measurement unit to a plane coordinate system of the transfer robot to teach the transfer robot.