APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE

    公开(公告)号:US20240219838A1

    公开(公告)日:2024-07-04

    申请号:US18341828

    申请日:2023-06-27

    CPC classification number: G03F7/162 G03F7/168

    Abstract: The inventive concept provides a substrate treating method. The substrate treating apparatus includes supplying a first liquid to a rotating substrate to treat a substrate; and supplying a second liquid which is different from the first liquid to the rotating substrate to coat the substrate with the second liquid, and wherein a rotation direction of the substrate is different at the supplying the first liquid and at the supplying the second liquid.

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