公开(公告)号：US20220406571A1

公开(公告)日：2022-12-22

申请号：US17842222

申请日：2022-06-16

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Soon-Cheon CHO ,  Yun Sang KIM

IPC: H01J37/32

Abstract: Disclosed is a substrate treating apparatus, including: a process chamber in which an inner space for treating a substrate is formed; an ion blocker for dividing the inner space into a plasma generating space and a treatment space; a substrate support unit for supporting a substrate in the treatment space; an exhaust unit for exhausting the treatment space; an anneal source positioned above the ion blocker and transmitting energy for annealing to the substrate through the ion blocker; and a gas supply unit for supplying process gas to the plasma generating space, in which the ion blocker includes: a body which is shaped like a disk, is made of a material through which microwaves are transmittable, and is formed with a plurality of through-holes; and a transparent conductive oxide film provided on at least one of an upper surface and a lower surface of the body in a first thickness or less.

公开(公告)号：US20220285139A1

公开(公告)日：2022-09-08

申请号：US17682029

申请日：2022-02-28

Applicant: SEMES CO., LTD.

Inventor： Jung Hoon PARK ,  Yun Sang KIM ,  Min Sung JEON ,  Soon-Cheon CHO ,  Sung Min CHOI ,  Jin Hee HONG

IPC: H01J37/32

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprises a chamber having a treating space therein; a support unit placed within the treating space and supporting a substrate; and a plasma generating unit for generating a plasma from a process gas supplied to the treating space, and wherein the plasma generating unit comprising: a first electrode; and a second electrode facing the first electrode, the second electrode made of a material capable of transmitting electromagnetic waves.

公开(公告)号：US20230120716A1

公开(公告)日：2023-04-20

申请号：US17967172

申请日：2022-10-17

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Yun Sang KIM ,  Soon-Cheon CHO ,  Sang Jeong LEE ,  Jong Won PARK ,  Hyun Woo JO

IPC: H01J37/32 ,  H05B6/70

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a plurality of process chambers for performing a first process using a microwave energy; one microwave generator for generating a microwave; a wave guide connecting to each of the plurality of process chambers and the microwave generator; and a microwave path changing member provided at a microwave transfer path of the wave guide and changing the microwave transfer path of one chosen chamber among the plurality of process chambers.