公开(公告)号：US20240203704A1

公开(公告)日：2024-06-20

申请号：US18526489

申请日：2023-12-01

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Yun Sang KIM ,  Han Lim KANG ,  Hyun Woo JO ,  Sang Jeong LEE ,  Youn Gun BONG

IPC: H01J37/32

CPC classification number: H01J37/32651 ,  H01J37/32522 ,  H01J37/3255 ,  H01J37/32568 ,  H01J2237/3348

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes an ion blocker dividing the inner space into a first space at a bottom side and a second space at a top side; a support unit configured to support a substrate at the first space; and a plasma source generating a plasma at the inner space, and wherein a plurality of passages are formed at the ion blocker for flowing a fluid from the second space to the first space, and the ion blocker is made of a dielectric substance, and an ion among an ion and a radical included in the plasma is captured while passing through the passage.

公开(公告)号：US20230411117A1

公开(公告)日：2023-12-21

申请号：US18097232

申请日：2023-01-14

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Sang Jeong LEE ,  Jae Won SHIN ,  Hyun Woo JO ,  Jong Won PARK

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/3244 ,  H01J37/32119

Abstract: An antenna member includes a first coil and a second coil that are rotationally symmetrical with each other, wherein the first coil includes a first supply terminal to which current is applied, a first ground terminal connected to a ground, and a first shunt capacitor shunted between the first supply terminal and the first ground terminal, the second coil includes a second supply terminal to which current is applied, a second ground terminal connected to the ground, and a second shunt capacitor shunted between the second supply terminal and the second ground terminal, the first coil includes an arc-shaped first portion and an arc-shaped second portion, and the first portion and the second portion form a one-turn winding as a whole, the second coil includes an arc-shaped first portion and an arc-shaped second portion, and the first portion and the second portion form a one-turn winding as a whole, the second portion has a height lower than a height of the first portion, the second portion of the second coil is disposed below the first portion of the first coil, and the second portion of the first coil is disposed below the first portion of the second coil.

公开(公告)号：US20230120716A1

公开(公告)日：2023-04-20

申请号：US17967172

申请日：2022-10-17

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Yun Sang KIM ,  Soon-Cheon CHO ,  Sang Jeong LEE ,  Jong Won PARK ,  Hyun Woo JO

IPC: H01J37/32 ,  H05B6/70

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a plurality of process chambers for performing a first process using a microwave energy; one microwave generator for generating a microwave; a wave guide connecting to each of the plurality of process chambers and the microwave generator; and a microwave path changing member provided at a microwave transfer path of the wave guide and changing the microwave transfer path of one chosen chamber among the plurality of process chambers.

公开(公告)号：US20240212995A1

公开(公告)日：2024-06-27

申请号：US18390078

申请日：2023-12-20

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Yun Sang KIM ,  Sang Jeong LEE ,  Jae Won SHIN ,  Jong Won PARK

IPC: H01J37/32

CPC classification number: H01J37/32697 ,  H01J37/32522 ,  H01J37/32541 ,  H01J37/3255 ,  H01J37/32724 ,  H01J2237/2007

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, and wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.

公开(公告)号：US20230207272A1

公开(公告)日：2023-06-29

申请号：US18056046

申请日：2022-11-16

Applicant: SEMES CO., LTD. ,  PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION

Inventor： Sang Jeong LEE ,  Yoon Seok CHOI ,  Sun Wook JUNG ,  Ho-Jun LEE ,  Sang Woo KIM

IPC: H01J37/32

CPC classification number: H01J37/32201 ,  H01J37/3244 ,  H01J37/32229

Abstract: An exemplary embodiment of the present invention provided an apparatus for treating a substrate. The apparatus for treating the substrate includes a process chamber having a treating space therein, a support unit for supporting the substrate in the treating space, gas supply unit for supplying treating gas to the treating space, and a microwave application unit for applying microwaves to the treating gas to generate plasma, wherein the microwave application unit includes a transmission plate disposed above the support unit to radiate the microwaves to the treating space, a first waveguide disposed above the transmission plate, and a first power supply for applying the microwaves to the first waveguide, wherein the first waveguide is provided in a ring shape.

公开(公告)号：US20240213001A1

公开(公告)日：2024-06-27

申请号：US18542776

申请日：2023-12-18

Applicant: SEMES CO., LTD.

Inventor： Young Jo JIN ,  Sang Jeong LEE ,  Min Sung JEON ,  Tae Hwan LEE ,  Min Hee HONG

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/687

CPC classification number: H01J37/32724 ,  H01J37/32522 ,  H01L21/30655 ,  H01L21/68742 ,  H01J2237/3341

Abstract: Proposed are a substrate treatment method and a substrate treatment apparatus that are capable of adjusting cooling efficiency for a substrate. According to an embodiment of the present disclosure, there may be provided the substrate treatment method including a heating process in which a surface of the substrate is heated and a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate. Furthermore, the cooling process includes a cooling condition controlling process in which a cooling condition is controlled.

公开(公告)号：US20240107639A1

公开(公告)日：2024-03-28

申请号：US18203669

申请日：2023-05-31

Applicant: SEMES CO., LTD.

Inventor： Han Lim KANG ,  Yoon Seok CHOI ,  Yun Sang KIM ,  Hyun Woo JO ,  Sang Jeong LEE

IPC: H05B6/80 ,  H05B6/64 ,  H05B6/78

CPC classification number: H05B6/80 ,  H05B6/6455 ,  H05B6/78 ,  H05B6/707

Abstract: An embodiment of the present disclosure provides a thermal processing apparatus and an operation method thereof capable of controlling a heat distribution of a substrate at a low cost in a thermal processing process using a microwave. According to the present disclosure, a thermal processing apparatus includes a chamber that forms a thermal processing space of a substrate, a substrate support unit that is located at a lower portion of the thermal processing space and supports the substrate, and a microwave unit that is located at an upper portion of the thermal processing space and forms an electromagnetic field by the microwave in the thermal processing space. The substrate support unit includes a chuck fixed at the lower portion of the thermal processing space, a lifting drive mechanism configured to support the substrate with raising and lowering the substrate with respect to the chuck, and a controller that controls the lifting drive mechanism to adjust a height of the substrate based on a temperature distribution for each area of the substrate.

公开(公告)号：US20230215706A1

公开(公告)日：2023-07-06

申请号：US18148078

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok CHOI ,  Hyun Woo JO ,  Sang Jeong LEE ,  Jong Won PARK ,  Hyoung Kyu SON

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01J37/32715 ,  H01J37/32642 ,  H01L21/68742 ,  H01L21/6833 ,  H01J2237/20235 ,  H01J2237/2007 ,  H01J2237/002 ,  H01J2237/334

Abstract: The inventive concept provides a substrate support unit. The substrate support unit includes a susceptor supporting the substrate and having a pinhole formed vertically; and a lift pin unit configured to load and unload the substrate on the susceptor, and wherein the lift pin unit includes: a lift pin vertically movable along the pinhole; a support vertically movable by a driving unit; a pin holder connecting the support and the lift pin, and wherein the lift pin is pivotably connected to the pin holder and the pin holder is laterally movable with respect to the support.