SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20250140534A1

    公开(公告)日:2025-05-01

    申请号:US18826150

    申请日:2024-09-05

    Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit configured to support a substrate in the processing space, a microwave unit configured to supply microwaves to the processing space, a window member disposed below the microwave unit and configured to transmit the microwaves supplied from the microwave unit, a heat transfer plate disposed in the processing space so as to be spaced a predetermined distance from the window member and configured to be heated by the microwaves supplied to the processing space and to transfer heat to the substrate, and a controller configured to control the microwave unit.

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