公开(公告)号：US20230197411A1

公开(公告)日：2023-06-22

申请号：US18080700

申请日：2022-12-13

Applicant: SEMES CO., LTD.

Inventor： Hyun Jin KIM ,  Jung Hwan LEE ,  Galstyan OGSEN ,  Sung Suk WI ,  Min Keun BAE

IPC: H01J37/32 ,  H03H7/38

CPC classification number: H01J37/32183 ,  H01J37/32091 ,  H03H7/38 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/3343

Abstract: An impedance matching circuit, which is provided for quick impedance matching, a power supply apparatus, and a plasma processing equipment including the same are provided. The impedance matching circuit includes a parallel capacitor array connected to a radio frequency (RF) power supply to generate a RF signal, and a series capacitor array connected to the RF power supply in series, wherein the parallel capacitor array or the series capacitor array includes a mechanical vacuum variable capacitor and an electrical switch capacitor module connected to the mechanical vacuum variable capacitor in parallel.

公开(公告)号：US20240206027A1

公开(公告)日：2024-06-20

申请号：US18538765

申请日：2023-12-13

Applicant: SEMES CO., LTD.

Inventor： Han Lim KANG ,  Yoon Seok CHOI ,  Sung Suk WI

IPC: H05B6/64

CPC classification number: H05B6/6402

Abstract: A thermal processing apparatus using microwaves and a method of operating the same are proposed. Provided is the thermal processing apparatus and an operation method thereof capable of converting a mode of the microwaves emitted into a processing space without changing equipment design. The thermal processing apparatus using microwaves includes a chamber configured to form the thermal processing space for a substrate and have an inner wall to which an electrophoresis film attached, a substrate support unit positioned on a lower part of the thermal processing space and supporting the substrate, a microwave unit positioned on an upper part of the thermal processing space and forming an electromagnetic field generated by the microwaves in the thermal processing space, and a controller for controlling the electrophoretic film so as to control movement paths of the microwaves on the basis of a process condition and a size of the substrate.

公开(公告)号：US20240177971A1

公开(公告)日：2024-05-30

申请号：US18507420

申请日：2023-11-13

Applicant: SEMES CO., LTD.

Inventor： Sung Suk WI ,  Yoon Seok CHOI ,  Hanlim KANG

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32165 ,  H01J2237/3341

Abstract: Provided is a matching network module including a plurality of housings individualized to reduce cross radio frequency (RF) interference, a plurality of matching networks respectively mounted in the plurality of housings to separately perform impedance matching between a plurality of RF generators and a plasma chamber, and a common output rod connecting output terminals of the plurality of matching networks to each other.