公开(公告)号：US20250140534A1

公开(公告)日：2025-05-01

申请号：US18826150

申请日：2024-09-05

Applicant: SEMES CO., LTD.

Inventor： Young Seo AN ,  Sang Man PARK ,  Han Lim KANG ,  In Hoe KIM ,  Yoon Seok CHOI ,  Sung Suk WI ,  Tae Hun KANG

IPC: H01J37/32

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a chamber including a processing space defined therein, a substrate support unit configured to support a substrate in the processing space, a microwave unit configured to supply microwaves to the processing space, a window member disposed below the microwave unit and configured to transmit the microwaves supplied from the microwave unit, a heat transfer plate disposed in the processing space so as to be spaced a predetermined distance from the window member and configured to be heated by the microwaves supplied to the processing space and to transfer heat to the substrate, and a controller configured to control the microwave unit.

公开(公告)号：US20240404793A1

公开(公告)日：2024-12-05

申请号：US18413805

申请日：2024-01-16

Applicant: SEMES CO., LTD.

Inventor： Wook Sang JANG ,  Jae Woong SIM ,  Dong Uk KIM ,  In Hoe KIM

IPC: H01J37/32

Abstract: Disclosed are a substrate treating apparatus and a fluid supply unit that reduce the outer diameter while preventing condensation from occurring even without wrapping a pipe supplying a refrigerant with a heat insulating material. The substrate treating apparatus includes: a process chamber having a treatment space for treating a substrate; an inner pipe connected to the process chamber and for supplying a heat exchange fluid to an interior of the process chamber; a cooler connected to the inner pipe, and for cooling the heat exchange fluid and supplying the cooled heat exchange fluid to the inner pipe; an outer pipe disposed on an outer side of the inner pipe while surrounding the inner pipe to form a suction space between the inner pipe and the outer pipe; an intake part connected to the suction space, and for sucking the suction space; and a spacing maintaining part disposed in the suction space, and for maintaining a spacing distance between the inner pipe and the outer pipe.

公开(公告)号：US20230133714A1

公开(公告)日：2023-05-04

申请号：US17976996

申请日：2022-10-31

Applicant: SEMES CO., LTD.

Inventor： Dong Uk KIM ,  In Hoe KIM ,  Hyoung Kyu SON

IPC: H01J37/32 ,  H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space; a separation unit provided at the inner space and configured to be combined with the chamber to divide the inner space into a plurality of treating spaces and a transfer space; a plurality of support units provided at each of the plurality of treating spaces and configured to support a substrate; a plurality of gas supply units provided at each of the plurality of treating spaces and configured to supply a process gas to the substrate supported on the plurality of support units; and a transfer unit provided at the transfer space and configured to transfer the substrate between the plurality of treating spaces.