Substrate treating apparatus and substrate treating method

    公开(公告)号:US12083551B2

    公开(公告)日:2024-09-10

    申请号:US17884709

    申请日:2022-08-10

    CPC classification number: B05C5/0225 B05C11/1002 B05C11/1031

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

Patent Agency Ranking