Apparatus for treating substrate and temperature control method

    公开(公告)号:US12300517B2

    公开(公告)日:2025-05-13

    申请号:US17547182

    申请日:2021-12-09

    Abstract: The inventive concept provides a temperature controlling method. The temperature controlling method for controlling a temperature of a tank storing a treating fluid transferred to the chamber, comprises supplying the treating fluid to the inner space of the tank, heating the treating fluid at the inner space, and transferring the heated treating fluid to the chamber, wherein the temperature of the inner space is controlled based on a measured pressure of the inner space.

    Apparatus for treating substrate and method of coupling support unit

    公开(公告)号:US12266561B2

    公开(公告)日:2025-04-01

    申请号:US17529649

    申请日:2021-11-18

    Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

    Substrate treating apparatus and substrate treating method

    公开(公告)号:US12083551B2

    公开(公告)日:2024-09-10

    申请号:US17884709

    申请日:2022-08-10

    CPC classification number: B05C5/0225 B05C11/1002 B05C11/1031

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

    Apparatus for treating substrate and apparatus for measuring concentration

    公开(公告)号:US12057335B2

    公开(公告)日:2024-08-06

    申请号:US17957428

    申请日:2022-09-30

    CPC classification number: H01L21/67253 G01N1/10 H01L21/67034

    Abstract: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

    Apparatus for treating substrate and temperature control method

    公开(公告)号:US12272569B2

    公开(公告)日:2025-04-08

    申请号:US17547182

    申请日:2021-12-09

    Abstract: The inventive concept provides a temperature controlling method. The temperature controlling method for controlling a temperature of a tank storing a treating fluid transferred to the chamber, comprises supplying the treating fluid to the inner space of the tank, heating the treating fluid at the inner space, and transferring the heated treating fluid to the chamber, wherein the temperature of the inner space is controlled based on a measured pressure of the inner space.

    Apparatus for treating substrate
    6.
    发明授权

    公开(公告)号:US12278119B2

    公开(公告)日:2025-04-15

    申请号:US17837135

    申请日:2022-06-10

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.

    Tower lift
    8.
    发明授权

    公开(公告)号:US11591167B2

    公开(公告)日:2023-02-28

    申请号:US16396120

    申请日:2019-04-26

    Abstract: A tower lift includes a main frame extending in a vertical direction, a carriage module configured to be movable in the vertical direction along the main frame, a weight module disposed behind the carriage module and configured to be movable in the vertical direction along the main frame, a driving module disposed on the main frame and configured to move the carriage module and the weight module in the vertical direction using at least one timing belt, an auto tensioner disposed on a lower portion of the main frame and connected with the carriage module and the weight module by a balance belt, and an upper alignment unit for aligning a horizontal position of the at least one timing belt.

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