公开(公告)号：US11967491B2

公开(公告)日：2024-04-23

申请号：US17177135

申请日：2021-02-16

Applicant: SEMES CO., LTD.

Inventor： Soon-Cheon Cho ,  Su Hyung Lee ,  Youngran Ko ,  Juyong Jang

IPC: H01L21/67 ,  B08B7/00 ,  B08B13/00 ,  H01J37/32

CPC classification number: H01J37/32862 ,  B08B7/0035 ,  B08B13/00 ,  H01J37/3244 ,  H01L21/67034 ,  H01J37/32192 ,  H01J37/32825 ,  H01J2237/002 ,  H01J2237/335

Abstract: The present invention provides a method and apparatus for cleaning parts used in substrate processing. In a method for cleaning parts of a substrate processing, plasma generated from cleaning gas is supplied together with a cooling medium to clean the parts, but the cooling medium may be provided at a lower temperature than the plasma.

公开(公告)号：US11977332B2

公开(公告)日：2024-05-07

申请号：US17017786

申请日：2020-09-11

Applicant: SEMES CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Hae-Won Choi ,  Yerim Yeon ,  Anton Koriakin ,  Kihoon Choi ,  Youngran Ko ,  Jeong Ho Cho ,  Hyungseok Kang ,  Hong Gi Min

IPC: G03F7/16 ,  G03F7/039 ,  G03F7/32 ,  H01L21/67

CPC classification number: G03F7/162 ,  G03F7/168 ,  H01L21/67225 ,  G03F7/039 ,  G03F7/322

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a first process chamber to apply an organic solvent to a substrate applied with a developer and introduced, and a second process chamber to treat the substrate applied with the organic solvent and introduced, through a supercritical fluid.