公开(公告)号：US20240153792A1

公开(公告)日：2024-05-09

申请号：US18387713

申请日：2023-11-07

申请人： SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： Min Jung KIM ,  Jin Ah HAN ,  Hee Hwan KIM ,  Yong Hoon HONG ,  Kyoung Suk KIM ,  Jong Hyeok PARK ,  Jin Hyung PARK ,  Dae Hyuk CHUNG ,  Ji Hoon CHA

IPC分类号： H01L21/67 ,  H01L21/306

CPC分类号： H01L21/6708 ,  H01L21/30604

摘要： An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution. The apparatus includes a substrate rotating device configured to rotate a seated substrate in a spinning manner, a chemical solution supply device configured to supply a chemical solution to the substrate, a chemical solution discharge line configured to discharge the chemical solution having undergone a process to an outside, a chemical solution circulation line configured to circulate the chemical solution having undergone the process to the chemical solution supply device, and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of process by-products to the outside through the chemical solution discharge line and to circulate a chemical solution containing a second amount of process by-products through the chemical solution circulation line, wherein the first amount of process by-products is larger than the second amount of process by-products.