公开(公告)号：US20240011158A1

公开(公告)日：2024-01-11

申请号：US18474493

申请日：2023-09-26

Applicant: SEMES Co., Ltd.

Inventor： Hee Hwan Kim ,  Cheol Yong Shin ,  Jae Youl Kim ,  Moon Sik Choi

IPC: C23C16/458 ,  C23C16/455

CPC classification number: C23C16/4584 ,  C23C16/45565

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

公开(公告)号：US20240001672A1

公开(公告)日：2024-01-04

申请号：US18144170

申请日：2023-05-06

Applicant: SEMES CO., LTD.

Inventor： Cheol Yong Shin ,  Jae Youl Kim ,  In Ho Kim ,  Jin Woo Jang

IPC: B41J2/14

CPC classification number: B41J2/14314 ,  B41J2/14201 ,  B41J2002/14491

Abstract: An inkjet apparatus for display manufacturing includes a nozzle unit having a discharge port for discharging ink to a substrate, a charging unit disposed on a side of the nozzle unit and charging the ink, and an accelerating electrode disposed on an opposite side of the nozzle unit with the substrate interposed therebetween, and accelerating the ink towards the substrate by electrical attraction.

公开(公告)号：US20220205093A1

公开(公告)日：2022-06-30

申请号：US17526220

申请日：2021-11-15

Applicant: SEMES Co., Ltd.

Inventor： Hee Hwan Kim ,  Cheol Yong Shin ,  Jae Youl Kim ,  Moon Sik Choi

IPC: C23C16/458 ,  C23C16/455

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.