公开(公告)号：US20240011158A1

公开(公告)日：2024-01-11

申请号：US18474493

申请日：2023-09-26

Applicant: SEMES Co., Ltd.

Inventor： Hee Hwan Kim ,  Cheol Yong Shin ,  Jae Youl Kim ,  Moon Sik Choi

IPC: C23C16/458 ,  C23C16/455

CPC classification number: C23C16/4584 ,  C23C16/45565

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

公开(公告)号：US12297545B2

公开(公告)日：2025-05-13

申请号：US18146489

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Jun Kil Hwang ,  Min Jung Kim ,  Hee Hwan Kim ,  Seong Soo Lee

IPC: C23F1/46 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  H01L21/02

Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

公开(公告)号：US20220205093A1

公开(公告)日：2022-06-30

申请号：US17526220

申请日：2021-11-15

Applicant: SEMES Co., Ltd.

Inventor： Hee Hwan Kim ,  Cheol Yong Shin ,  Jae Youl Kim ,  Moon Sik Choi

IPC: C23C16/458 ,  C23C16/455

Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.