公开(公告)号：US11004777B2

公开(公告)日：2021-05-11

申请号：US16456161

申请日：2019-06-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome Teysseyre ,  Chung-Lin Wu ,  Bigildis Dosdos

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: In one general aspect, an apparatus can include a leadframe including a plurality of leads configured to provide electrical connections for the apparatus. The apparatus can also include a semiconductor die disposed on the leadframe and a conductive clip electrically coupling the semiconductor die with the leadframe. The apparatus can further include a heat slug disposed on the conductive clip. The heat slug can include a thermally conductive and electrically insulative material.

公开(公告)号：US10943855B2

公开(公告)日：2021-03-09

申请号：US16102922

申请日：2018-08-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Cristina Estacio ,  Marlon Bartolo ,  Maria Clemens Ypil Quinones ,  Chung-Lin Wu

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H01L23/538

Abstract: In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a second plurality of signal leads. The substrate can be coupled with a subset of the first plurality of signal leads and a subset of the second plurality of signal leads. Signal leads of the first plurality of signal leads, other than the subset of the first plurality of signal leads, can be spaced from the dielectric substrate. Signal leads of the second plurality of signal leads, other than the subset of the second plurality of signal leads, can be spaced from the dielectric substrate. The assembly can further include first and second semiconductor die that are electrically coupled with the substrate and the leadframe portions.

公开(公告)号：US11735508B2

公开(公告)日：2023-08-22

申请号：US17453623

申请日：2021-11-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome Teysseyre ,  Romel Manatad ,  Chung-Lin Wu ,  Bigildis Dosdos ,  Erwin Ian Almagro ,  Maria Cristina Estacio

IPC: H01L23/498 ,  H01L23/495

CPC classification number: H01L23/49827 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49586 ,  H01L2224/48137 ,  H01L2224/48247

Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

公开(公告)号：US12278169B2

公开(公告)日：2025-04-15

申请号：US17249529

申请日：2021-03-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Cristina Estacio ,  Marlon Bartolo ,  Maria Clemens Ypil Quinones ,  Chung-Lin Wu

IPC: H01L23/49 ,  H01L23/00 ,  H01L23/48 ,  H01L23/495 ,  H01L23/538

Abstract: In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a second plurality of signal leads. The substrate can be coupled with a subset of the first plurality of signal leads and a subset of the second plurality of signal leads. Signal leads of the first plurality of signal leads, other than the subset of the first plurality of signal leads, can be spaced from the dielectric substrate. Signal leads of the second plurality of signal leads, other than the subset of the second plurality of signal leads, can be spaced from the dielectric substrate. The assembly can further include one or more semiconductor die that are electrically coupled with the substrate and the leadframe portions.

公开(公告)号：US20210193561A1

公开(公告)日：2021-06-24

申请号：US17249529

申请日：2021-03-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Cristina Estacio ,  Marlon Bartolo ,  Maria Clemens Ypil Quinones ,  Chung-Lin Wu

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/48

Abstract: In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a second plurality of signal leads. The substrate can be coupled with a subset of the first plurality of signal leads and a subset of the second plurality of signal leads. Signal leads of the first plurality of signal leads, other than the subset of the first plurality of signal leads, can be spaced from the dielectric substrate. Signal leads of the second plurality of signal leads, other than the subset of the second plurality of signal leads, can be spaced from the dielectric substrate. The assembly can further include one or more semiconductor die that are electrically coupled with the substrate and the leadframe portions.